TSMC: 5 nm på bane til Q2 2020 HVM, rampe hurtigere end 7 nm



TSMC vice chairman and CEO C.C. Wei announced the company's plans for 5 nm are on track, which means High Volume manufacturing (HVM) on the node is expected to be achieved by 2Q 2020. The company has increased expenditures in ramping up its various nodes from an initially projected $10 billion to something along the lines of $14 billion - 15 billion; the company is really banking on quick uptake and design wins on its most modern process technologies - and the increased demand that follows.

TSMCs 5 nm-proces (N5) bruger ekstrem ultraviolet litografi (EUVL) i mange flere lag end dens N7 + og N6-processer, hvor op til 14 lag er ætset i N5-silicium sammenlignet med henholdsvis fem og seks for dets 'ældre'. N7 + og N6 processer. Når virksomheden øger investeringerne i anskaffelse af EUVL-udstyr, der opsætter sine produktionsknudepunkter for det marked, de forudser, bare vil gabbere op chipsene i 2020, er virksomheden optimistisk for at de kan opnå vækst i antallet af 5-10%.
Source: AnandTech