tsmc 7nm euv-processen til masseproduktion i marts 2019 - Tsmc

TSMC 7nm EUV-proces til masseproduktion i marts 2019

TSMC is giving final touches to set its flagship 7 nanometer EUV (extreme ultraviolet lithography) silicon fabrication node at its highest state of readiness for business, called mass-production. At this state, the node can mass-produce products for TSMC's customers. TSMC had taped out its first 7 nm EUV chips in October 2018. The company will also begin risk-production of the more advanced 5 nm node in April, staying on schedule. Mass production of 5 nm chips could commence in the first half of 2020.

Den 7 nm EUV-knude forøger TSMCs 7 nm DUV (dyb ultraviolet litografi) -knude, der allerede har været aktiv siden april 2018, og producerer chips til AMD, Apple, HiSilicon og Xilinx. Ved årsskiftet udgjorde 7 nm DUV 9 procent af TSMC's forsendelser. Med den nye node, der går online, kunne 7 nm (DUV + EUV) udgøre 25 procent af TSMC's produktion ved udgangen af ​​2019.


Source: DigiTimes